Shielding arrangement

Details Shielding arrangement Shielding arrangement

2005-11-15

2005-11-15

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Anti-inductive structures

Conductor transposition

C174S034000, C361S816000

Reexamination Certificate

active

06965072

ABSTRACT:
The invention relates to an enhanced shielding arrangement. A shielding arrangement comprises a shielding can and a layered printed circuit board having electrical components and at least two ground potential layers. There are grounding connections between edges of the shielding can and at least one of the ground potential layers, and grounding connections between components inside the shielding can and at least one of the ground potential layers, so that the two grounding connections are connected to each other only through at least one of the ground potential layers for providing small loops.

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Patent Abstracts of Japan, vol. 200, No. 002, Publication No. 11-330703, Publication Date: Nov. 30, 1999.

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