Shielded surface acoustical wave package

Details Shielded surface acoustical wave package Shielded surface acoustical wave package

1997-09-09

1999-08-17

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Entirely of metal except for feedthrough

257678, H01L 2310

Patent

active

059397845

ABSTRACT:
A package for surface acoustical wave (SAW) device includes an electrically insulative substrate having a first surface with an electrically conductive layer formed thereon. A first surface of the SAW device is attached to the electrically conductive layer. An electrically conductive adhesive bead overlies the substrate first surface and surrounds the SAW device. An electrically conductive lid defines a free space over a second surface of the SAW device, the lid being electrically connected to the electrically conductive layer by the adhesive bead and one or more tabs extending from the lid through the adhesive bead to the electrically conductive layer. The electrically conductive adhesive bead, electrically conductive layer and electrically conductive lid enclose and shield the SAW device.

REFERENCES:
patent: 4691225 (1987-09-01), Murakami et al.
patent: 4993000 (1991-02-01), Niitsuma et al.
patent: 5075652 (1991-12-01), Sugai
patent: 5216278 (1993-06-01), Lin et al.
patent: 5394011 (1995-02-01), Yamamoto et al.
patent: 5629835 (1997-05-01), Mahulikar et al.

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