Shielded stripline configuration semiconductor device and method

Details Shielded stripline configuration semiconductor device and method Shielded stripline configuration semiconductor device and method

1992-09-24

1994-05-31

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 35R, 257659, 361818, H01L 2302, H05K 900

Patent

active

053171071

ABSTRACT:
Electrical parasitic parameters can lead to reflections and switching noise in a circuit causing signal distortions. A stripline configuration semiconductor device (10) can be manufactured to reduce the overall parasitic parameters, especially inductance, of a device. In one embodiment, a semiconductor die (12) having a grounded backside (20) is directly bonded with an electrically conductive adhesive (22) to a metal base (16), thus grounding the metal base. The die is also electrically connected to a leadframe (14) by wire bonds (24). An electrically insulating adhesive (28) is used to seal a metal lid (18) to the metal base with the die and leadframe disposed between the lid and base, thus forming a protective package body. The lid is grounded to a ground lead (26) of the leadframe with a solder bridge (30). An additional advantage to having a metal package body is that it provides shielding for the device.

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