Shielded semiconductor chip carrier having a high-density...

Details Shielded semiconductor chip carrier having a high-density... Shielded semiconductor chip carrier having a high-density...

2006-11-14

2006-11-14

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S659000

Reexamination Certificate

active

07135764

ABSTRACT:
A shielded semiconductor chip carrier having a high-density external interface includes conventional printed circuit boards having plated through holes for achieving shielding of the contacts of the matrix. Two fork type connectors have molded about the distal ends thereof an annular ring of dielectric plastic material, and fork type connectors are press fit into each plated through hole, thereby locking the electrical contact within the shield formed by the plated through hole. The resulting connector provides a high-density contact matrix with each connector being electrically shielded along substantially its entire length.

REFERENCES:
patent: 5548486 (1996-08-01), Kman et al.
patent: 5575688 (1996-11-01), Crane, Jr.
patent: 5659953 (1997-08-01), Crane et al.
patent: 5696027 (1997-12-01), Crane et al.
patent: 6577003 (2003-06-01), Crane, Jr. et al.

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