Shielded self-molding package for an electronic component

Details Shielded self-molding package for an electronic component Shielded self-molding package for an electronic component

1993-07-06

1995-02-28

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361748, 361761, 361771, 361816, 174256, 174 35R, 257787, H05K 116

Patent

active

053943040

ABSTRACT:
An electromagnetically shielded self-molding package for an electronic component comprises a pair of bags having an electrically conductive coating therebetween and disposed about the component and having a polymerizable resin completely filling the space between the bags and the component.

REFERENCES:
patent: 5166864 (1992-11-01), Chitwood et al.

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