Electricity: conductors and insulators – Anti-inductive structures – Conductor transposition
Patent
1990-10-09
1992-10-06
Picard, Leo P.
Electricity: conductors and insulators
Anti-inductive structures
Conductor transposition
174 522, 174 524, 357 72, 357 74, 361424, H05K 900, H01L 2302, H01L 2328
Patent
active
051533790
ABSTRACT:
A shielded low-profile electronic component assembly 100 providing shielding for electronic components is disclosed which includes a substrate 124, and shield 102. In a first embodiment the shield 102 is chamfered at each shield corner 110 and is attached to the substrate 124 at ground pad patterns 114, which are found at each corner of the substrate 124 on surface 128. A ground paddle 120 is also located in substrate 124 which lies substantially underneath the electronic component 112, and is utilized in maximizing shielding. In an alternate embodiment a substrate 124 is overmolded with encapsulation material 302 after the electronic component 112 is affixed to the substrate 124, with each of the encapsulation material corners 306 being chamfered exposing ground pads 114. The metallized shield 310 is then placed over the overmolded encapsulant and attached to the substrate 124 at ground pad patterns 114. The overmolded encapsulant 302 adding protection to the electronic component 112. In a third embodiment the metallized shield is slightly smaller in area than the substrate 124 and is attached at each of the four ground pads 114, with the shield edges 204 resting on substrate 124.
REFERENCES:
patent: 4967315 (1990-10-01), Schelhorn
Bernardoni Lonnie L.
Engstrom Scott M.
Guzuk Andrzej T.
Roshitsh Todd W.
Hernandez Pedro P.
Ledynh Bot L.
Motorola Inc.
Picard Leo P.
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