Fishing – trapping – and vermin destroying
Patent
1994-07-05
1995-07-25
Picardat, Kevin M.
Fishing, trapping, and vermin destroying
437211, 437214, 437219, 437224, H01L 2160
Patent
active
054362032
ABSTRACT:
A semiconductor (30) is shielded from electromagnetic interference by a combination of a reference plane (22) of a circuitized substrate (12) and two different encapsulants. The first encapsulant (38) is an electrically insulative encapsulant which mechanically protects a semiconductor die (32). The first encapsulant is constrained by a dam structure (40) so as not to encapsulate conductive reference pads (18) which are electrically connected to the reference plane by conductive vias (20). A second encapsulant (42) is dispensed over the first encapsulant and is in contact with the reference pads. The second encapsulant is an electrically conductive encapsulant, and is preferably made of a precursor material having the same or similar properties as that of the first encapsulant, but is filled with conductive filler particles to establish electrical conductivity of the encapsulant. Accordingly, the semiconductor die is effectively shielded from both the top and bottom by the electrically conductive encapsulant and the reference plane.
REFERENCES:
patent: 4218701 (1980-08-01), Shirasaki
patent: 4264917 (1981-04-01), Vgon
patent: 4477828 (1984-10-01), Scherer
patent: 4707725 (1987-11-01), Ito
patent: 4758875 (1988-07-01), Fujisaki et al.
patent: 4766095 (1988-08-01), Hiroshi
patent: 4768081 (1988-08-01), Moeller
patent: 4788583 (1988-11-01), Kawahara et al.
patent: 4843036 (1989-06-01), Schmidt et al.
patent: 4916522 (1990-04-01), Cohn
patent: 4962415 (1990-10-01), Yamamoto et al.
patent: 5041395 (1991-08-01), Steffen
patent: 5087961 (1992-02-01), Long et al.
patent: 5097317 (1992-03-01), Fujimoto et al.
patent: 5153379 (1992-10-01), Guzuk et al.
patent: 5166772 (1992-11-01), Soldner et al.
patent: 5206794 (1993-04-01), Long
patent: 5218234 (1993-06-01), Thompson et al.
patent: 5258650 (1993-11-01), Polak et al.
patent: 5311060 (1994-05-01), Rostoker et al.
Classen, et al; "Integrated Circuit Packages;" United States Statutory Invention Registration, No. H73, Filed Aug. 25, 1993, Appl. No. 526,413 and Published Jun. 3, 1986.
Goddard Patricia S.
Motorola Inc.
Picardat Kevin M.
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