Shielded interconnection boards

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

174 685, H01K 310

Patent

active

046464360

ABSTRACT:
Discloses a method for making a coaxial conductor interconnection circuit board, as well as the board per se, by providing a first conductive coating on a substrate, scribing an insulated wire signal conductor pattern on the first coating and a second conductive coating over the wire to provide a conductive shield surrounding the wire, eliminating conductive material from the coatings in clearance areas at terminal points and drilling at the terminal points by laser beam or mechanical drilling to expose the signal conductor.

REFERENCES:
patent: 3281627 (1966-10-01), Fetterolf et al.
patent: 3293353 (1966-12-01), Hendriks et al.
patent: 3305622 (1967-02-01), Bergsman et al.
patent: 3465308 (1969-09-01), Sasaki et al.
patent: 3469016 (1969-09-01), Shelton
patent: 3499215 (1970-03-01), Fetterolf et al.
New Miltiwire Meets the Challenge of Interconnecting Chip-Carriers Electronics, vol. 52, No. 26, pp. 117ff, by G. Messner et al.

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