Shielded housing for optical semiconductor component

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S432000, C257S433000, C257S434000, C257S435000, C257S680000

Reexamination Certificate

active

06870238

ABSTRACT:
An optical semiconductor package includes an optical semiconductor component (8), a front face of which has an optical sensor (10), and encapsulation defining a cavity in which the optical component is placed and having external electrical connection (11) of this optical semiconductor component (8). The encapsulation (2, 5) includes a glass pane letting light through to the optical sensor. The encapsulation (2, 5) includes electromagnetic screening (23, 24, 28) made of an electrically conductive material, that is externally connectable, this screening being electrically isolated in the optical semiconductor package from the electrical connection of the optical semiconductor component (8).

REFERENCES:
patent: 5650659 (1997-07-01), Mostafazadeh et al.
patent: 6150193 (2000-11-01), Glenn
patent: 6303978 (2001-10-01), Daniels et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Shielded housing for optical semiconductor component does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Shielded housing for optical semiconductor component, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Shielded housing for optical semiconductor component will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3382966

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.