Shielded enclosure for housing electronic components and manufac

Electricity: conductors and insulators – Anti-inductive structures – Conductor transposition

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295274, 361818, H05K 900

Patent

active

054731119

ABSTRACT:
An EMI protected enclosure and method of manufacture thereof. The enclosure is plastic and has an electromagnetic interference shield member disposed therein to protect the electronic parts or electronic equipment from electromagnetic interference. The electromagnetic interference shield member is exposed at the edges of the enclosure and can be formed into an electrical connector or otherwise connected to provide a ground for the enclosure. In the manufacturing method, the securing and shaping of the electromagnetic interference shield member by the closure of the molding dies eliminates the need for any pre-forming of the electromagnetic interference shield member.

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patent: 5239125 (1993-08-01), Savage et al.

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