Electricity: conductors and insulators – Anti-inductive structures – Conductor transposition
Patent
1994-04-19
1997-06-17
Thomas, Laura
Electricity: conductors and insulators
Anti-inductive structures
Conductor transposition
174 35R, 361816, 361818, 257655, 257660, H05K 100
Patent
active
056399898
ABSTRACT:
Electronic components are shielded from electromagnetic interference (EMI) by one or more conformal layers filled with selected filler particulars for attenuate specific EMI frequencies or a general range of frequencies. Shielding is accomplished through the use of a single general purpose shielding layer, or through a series of shielding layers for protecting more specific EMI frequencies. In a multilayer embodiment, a semiconductor device (50) is mounted on a printed circuit board substrate (16) as a portion of an electronic component assembly (10). A conformal insulating coating (24) is applied over the device to provide electrical insulation of signal paths (e.g. leads 54 and conductive traces 18) from subsequently deposited conductive shielding layers. One or more shielding layers (60, 62, and 64) are deposited, and are in electrical contact with a ground ring (56). In a preferred embodiment, the ground connections for the shield layers are separate from those used for power distribution within the devices.
REFERENCES:
patent: 5146047 (1992-09-01), Nagata et al.
patent: 5166772 (1992-11-01), Soldner et al.
patent: 5166864 (1992-11-01), Chitwood et al.
patent: 5175613 (1992-12-01), Barker, III et al.
patent: 5341274 (1994-08-01), Nakatani et al.
patent: 5379185 (1995-01-01), Griffen et al.
patent: 5392197 (1995-02-01), Cuntz et al.
patent: 5394304 (1995-02-01), Jones
patent: 5513078 (1996-04-01), Komrska et al.
William M. Hall; "Design Tech. for Control of Radiated and Conducted Noise in Portable Computing Equipment;" Northcon Conference, Oct. 1-3, '91; pp. 258-263 (Oct. 1991).
Howard W. Markstein; "Shielding Electronics From EMI/RFI;" Electronic Packaging & Production; pp. 40-44 (Jan. 1991).
Goddard Patricia S.
Motorola Inc.
Thomas Laura
LandOfFree
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