Metal fusion bonding – Process – With protecting of work or filler or applying flux
Patent
1990-12-13
1992-06-16
Heinrich, Samuel M.
Metal fusion bonding
Process
With protecting of work or filler or applying flux
228232, 228262, 228 37, B23K 100, B23K 300
Patent
active
051218747
ABSTRACT:
A wave soldering apparatus and process occurs in an atomsphere which substantially excludes oxygen. By providing a gas blanket over the solder, reduction in dross occurs and improved soldering results avoiding the necessity of removing flux residues. Gas diffusers are provided on both sides of a solder wave in an enclosure, the diffusers are placed below the path of the element to be soldered and a further gas diffuser is positioned above the element to be soldered. The gas diffusers supply a calm gas blanket over the solder wave so no turbulent movement of gas occurs within the enclosure.
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patent: 4606493 (1986-08-01), Christoph et al.
patent: 4610391 (1986-09-01), Nowotarski
patent: 4684056 (1987-08-01), Deambrosio
patent: 4848642 (1989-07-01), Kondo
patent: 4921156 (1990-05-01), Hohnerlein
M. Nowotarski, "Fluxless Soldering With Nitrogen",: Proc. NEPCON West (Feb. 26-Mar. 1, 1990), pp. 459-472 (publication date unknown).
M. Nowotarski, et al., "The Effect of a Nitrogen Atmosphere on the Wave Tinning of Component Leads," Presented at NEPCON West (Feb. 25-27, 1986) (precise publication date unknown).
IBM Technical Disclosure Bulletin, "Oxidation Prevention", vol. 11, No. 12, p. 1687, May 1969.
Hartmann, H. J., "Lotsystem mit Schutzgaslot Zone", pp. 22-31, Nov. 2, 1989.
Deambrosio Carlos A.
Gileta John
Electrovert Ltd.
Heinrich Samuel M.
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