Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Patent
1989-11-22
1991-09-03
Heinrich, Sam
Metal fusion bonding
Including means to apply flux or filler to work or applicator
By partial or total immersion of work or applicator into liquid
228 42, 228 43, 118421, 118423, 118429, B23K 300
Patent
active
050445421
ABSTRACT:
A wave soldering apparatus and process occurs in an atmosphere which substantially excludes oxygen. By providing a pressurized effect on an element to be soldered while passing through a solder wave, fluxless soldering is accomplished avoiding the necessity to remove flux residues. The element is preheated in a shield gas atmosphere substantially excluding oxygen, moved in a predetermined path so that at least a portion of the element passes through the solder wave which is oscillated while the element is in the solder wave and maintained in the shield gas until solder on the element has solidified.
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IBM Technical Disclosure Bulletin, vol. 27, No. 11, p. 6395, Apr. 1985.
Lotsystem Mit Schutzgaslotzone, Hartmann et al., "Soft-Soldering Under Cover Gases", 11-1989.
Electrovert Ltd.
Heinrich Sam
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