Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1974-10-24
1976-04-27
Tupman, W.
Metal working
Method of mechanical manufacture
Assembling or joining
29590, 29591, 357 70, B01J 1700
Patent
active
039524035
ABSTRACT:
A shell eyelet axial lead header for a planar contact semiconductive device is disclosed wherein a series of bonding pads are first formed as part of a lead frame. The bonding pads are in a planar configuration, are supported by small breakable tabs from a surrounding ring and when the ring is broken away, the tabs are isolated from each other.
A shell eyelet, a glass preform with lead holes therethrough, leads with braze material attached at one end and a lead frame with bonding pads attached are assembled in an appropriate manner and passed through a furnace. The glass melts and bonds to the leads, to the shell eyelet and to the bonding pads. The lead braze melts and bonds the leads to the bonding pads. After cooling the supporting ring of the bonding pads is broken away to leave the isolated bonding pads and the finished device.
If the bonding pads are not sufficiently planar so as to receive the beams of a beam lead device, the bonding pads may be lapped to flatness.
REFERENCES:
patent: 3262022 (1966-07-01), Caracciolo
patent: 3450956 (1969-06-01), Bauer
patent: 3735213 (1973-05-01), Kausky
patent: 3859715 (1975-01-01), Duffek
Copeland Ben H.
Schaffert Richard L.
Bingham Michael D.
Jones, Jr. Maurice J.
Motorola Inc.
Tupman W.
Weiss Harry M.
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