Sheet sticking apparatus and sticking method

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With testing – measuring – and/or indicating means

Reexamination Certificate

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Details

C156S064000

Reexamination Certificate

active

07814954

ABSTRACT:
A sheet sticking apparatus10comprises a sheet feed-out unit12that feeds out an adhesive sheet S to a position facing a surface of a semiconductor wafer W and a press roller14that presses the adhesive sheet S to stick the adhesive sheet S onto the wafer W. The sheet feed-out unit12includes a tension measuring means35for measuring a tension of the adhesive sheet S between the sheet feed-out unit12and the press roller14and a sticking angle maintaining means37provided with a feed-out head49for maintaining a sticking angle θ. After measuring and adjusting the tension immediately before sticking the adhesive sheet S, the feed-out head49is lowered in proportion to the movement amount of the press roller14, thereby the sticking angle θ is maintained, and thus the tension is maintained at a constant level.

REFERENCES:
patent: 6238515 (2001-05-01), Tsujimoto et al.
patent: 04-293253 (1992-10-01), None
patent: 06032522 (1994-02-01), None
patent: 2004-047976 (2004-02-01), None
patent: 2005136306 (2005-05-01), None
patent: 2005-236049 (2005-09-01), None
PCT/JP2006/321223 International Search Report and English Translation.

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