Sheet resin composition and process for manufacturing...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies

Reexamination Certificate

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C438S108000, C438S113000, C438S118000, C438S459000, C438S460000

Reexamination Certificate

active

06884695

ABSTRACT:
A sheet resin composition is adhered to a silicon wafer. The sheet resin composition supports the silicon wafer during back grinding and dicing into chips. Further, the sheet resin composition interfacial underfills between a chip from the wafer and a substrate during subsequent fabrication of a semiconductor device, the chip being flip chip mounted to the substrate.

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