Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate
2005-04-26
2005-04-26
Feely, Michael J. (Department: 1712)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Subsequent separation into plural bodies
C438S108000, C438S113000, C438S118000, C438S459000, C438S460000
Reexamination Certificate
active
06884695
ABSTRACT:
A sheet resin composition is adhered to a silicon wafer. The sheet resin composition supports the silicon wafer during back grinding and dicing into chips. Further, the sheet resin composition interfacial underfills between a chip from the wafer and a substrate during subsequent fabrication of a semiconductor device, the chip being flip chip mounted to the substrate.
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Mizutani Masaki
Ueda Hirotaka
Amkor Technology Inc.
Feely Michael J.
Gunnison McKay & Hodgson, L.L.P.
Hodgson Serge J.
Nitto Denko Corporation
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