Sheet removing apparatus and method

Details Sheet removing apparatus and method Sheet removing apparatus and method

1998-06-04

2000-11-21

Osele, Mark A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156584, 156247, B32B 3500

Patent

active

061497584

ABSTRACT:
In an apparatus and method of using an adhesive tape to remove a protecting sheet applied to a semiconductor wafer, a heat-sensitive adhesive tape is thermocompressively bonded by a heat tool to an edge portion of the protecting sheet, after which a cutting blade cuts the adhesive sheet to a prescribed length, and then a tape peeling head grasps the cut adhesive tape and moves in a direction to pull the adhesive tape so as to remove the protecting sheet of the semiconductor wafer, with the removed sheet then being disposed of together with the adhesive tape into a disposal box.

REFERENCES:
patent: 4285759 (1981-08-01), Allen et al.
patent: 5006190 (1991-04-01), Earle
patent: 5009735 (1991-04-01), Ametani et al.
patent: 5254201 (1993-10-01), Konda et al.
patent: 5492590 (1996-02-01), Sakai
patent: 5891298 (1999-04-01), Kuroda et al.

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