Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2005-04-27
2010-12-07
Osele, Mark A (Department: 1791)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S345420, C156S583200
Reexamination Certificate
active
07846289
ABSTRACT:
A peeling apparatus10includes a peeling table11supporting a wafer W on which a sheet S is stuck and a sheet peeling unit12disposed above the peeling table11, in which sheet S can be peeled off with relative movement of the sheet peeling unit12and the peeling table11. The peeling apparatus10includes a support roll20of peeling tape PT, first and second rolls30, 31bonding the peeling tape PT to the sheet S surface, and a winding roll21of the peeling tape PT. Peeling-off is performed in a state of forming an initial peeling angle a1such that a peeling tape PT is folded in an aperture C formed between the second roll31and the sheet S, and afterwards the sheet S is peeled off at subsequent peeling angle a2corresponding to a diameter of the second roll31.
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International Search Report of PCT/JP2005/007950 date of mailing Aug. 30, 2005.
Kobayashi Kenji
Tsujimoto Masaki
Yoshioka Takahisa
Lintec Corporation
Osele Mark A
Westerman Hattori Daniels & Adrian LLP
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