Sheet peeling apparatus and peeling method

Details Sheet peeling apparatus and peeling method Sheet peeling apparatus and peeling method

2009-07-22

2011-10-18

Osele, Mark A (Department: 1745)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S715000, C156S764000, C156S930000, C156S941000

Reexamination Certificate

active

08038824

ABSTRACT:
A sheet peeling apparatus10includes: a supporting means11for supporting a semiconductor wafer W stuck with an adhesive sheet S; a tape sticking means14for sticking a peeling tape T to the adhesive sheet S; a pulling means13for pulling the peeling tape T; a peeling assisting means15including an endless member45which is positioned on the adhesive sheet S, and wound on a guide member41; and a sandwiching means16for sandwiching the adhesive sheet S between the endless member45and the sandwiching means16. In the sheet peeling apparatus10, the adhesive sheet S is peeled off due to the relative movement of the pulling means13and the supporting means11in a state that the adhesive sheet S is sandwiched between the peeling assisting means15and the sandwiching means16.

REFERENCES:
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patent: 2003/0092288 (2003-05-01), Yamamoto et al.
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patent: 2006-041160 (2006-02-01), None
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patent: 2007-329315 (2007-12-01), None
International Search Report of PCT/JP2009/063099, date of mailing Aug. 18, 2009.

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