Sheet-member containing a plurality of elongated enclosed electr

Stock material or miscellaneous articles – All metal or with adjacent metals – Workpiece with longitudinal passageway or stopweld material

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428613, 428935, 428936, 65168, 204 3, 204 9, 204 11, F28F 312, C25D 102

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active

048716235

ABSTRACT:
A sheet member and a method for constructing the sheet member. The sheet member includes a plurality of elongated, enclosed channels formed by electrodeposition.

REFERENCES:
patent: 2365670 (1944-12-01), Wallace
patent: 2890273 (1959-08-01), La Forge et al.
patent: 3445348 (1969-05-01), Aske
patent: 3520357 (1970-07-01), Bruner
patent: 3692637 (1972-09-01), Deverre et al.
patent: 3847211 (1974-11-01), Fichel et al.
patent: 3850762 (1974-11-01), Smith
patent: 3901731 (1975-08-01), Warszawski et al.
patent: 4078604 (1978-03-01), Christl et al.
patent: 4182412 (1980-01-01), Shum
patent: 4285779 (1981-08-01), Shiga et al.
patent: 4516632 (1985-05-01), Swift et al.
patent: 4622621 (1986-11-01), Barre
Wilson, Edward A. "Integral Liquid-Cooling System Simplified Design of Densely Packaged Computer", Electronics, Jan. 26, 1984.
Keyes, Robert W. "Heat Transfer in Forced Convection Through Fins", IEEE Transactions on Electron Devices, vol. ED-31, No. 9, Sep. 1984, pp. 1218-1221.
Hollworth, B. R., Gero, L. R. "Entrainment Effects on Impingement Heat Transfer: Part II-Local Heat Transfer Measurements", Journal of Heat Transfer, Nov. 1985, vol. 107, pp. 910-915.
Watari, Toshihiko et al., "Packaging Technology for the NEC SW Supercomputer," 35th Electronics Components Conference, Proceedings 1985, pp. 192-198.
Shafer, Donald A. "Basic Electroforming", Hallmark Cards Inc., Includes a Photograph of a Recess Enclosure as the Result of High Current Density Bridging During Electroplating.
Tuckerman, D. B. and Pease, R. F. W. "High-Performance Heat Sinking for VLSI", IEEE Electron Device Letters, vol. EDL-2, No. 5, May 1981.
Rodia, Carl M. "Electroforming", date unknown.
Simons R. E. and Chu, R. C. "Direct Immersion Cooling Techniques for High Density Electronic Packages and Systems", IBM Corporation, pp. 314-321.
Nakatogawa, Tetsundo, et al, "Heat Transfer of Round Turbulent Jet Impinging Normally on Flat Plate", University of Tokyo, Tokyo, Japan.
Goldberg, Norman "Narrow Channel Forced Air Heat Sink", IEEE Transactions on Components, Hybrids and Manufacturing Technology, vol. CHMT-7, No. 1, Mar. 1984, pp. 154-159.
Lyman, Jerry "Special Report Supercomputers Demand Innovation in Packaging and Cooling", Electronics, Sep. 22, 1982, pp. 136-143.
Pittier, M. S., Powers, D. M., Schnabel, D. L. "System Development and Technology Aspects of the IBM 3081 Processor Complex", IBM Journal of Research Development, vol. 26, No. 1, Jan. 1982, pp. 2-11.
Encyclopedia of Chemical Technology, Third Edition, vol. 8, John Wiley & Sons, 1979, pp. 738-750 and 826-868.

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