Sheet material especially useful for circuit boards

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

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Details

C156S062800, C156S308200, C156S308400, C156S308600, C156S314000, C156S296000, C442S067000, C442S118000, C442S164000, C427S118000, C427S220000, C427S221000

Reexamination Certificate

active

07459044

ABSTRACT:
A sheet comprising thermoplastic polymer (TP) and short high tensile modulus fibers, in which the concentration of TP in the middle of the sheet is higher than at the surface of the sheet, useful for making prepregs with a thermoset resin.

REFERENCES:
patent: 3591434 (1971-07-01), Hartstein
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patent: 3717528 (1973-02-01), Peerman et al.
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patent: 5196259 (1993-03-01), Pierini et al.
patent: 5306545 (1994-04-01), Shirayanagi et al.
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patent: 6368698 (2002-04-01), Rokman et al.
patent: 6805771 (2004-10-01), Colson et al.
patent: 6974514 (2005-12-01), Hamulski et al.
patent: 2002/0153111 (2002-10-01), Kumada et al.
patent: WO 88/04185 (1988-06-01), None
Derwent Publication Ltd., JP 53-111369, Nitto Electric Ind., Co. Sep. 28, 1978, Abstract.
Derwent Publication Ltd., JP 08 252372, Toray Ind., Inc., Oct. 3, 1955, Abstract.

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