Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2005-02-03
2008-12-02
Lam, Cathy F. (Department: 1794)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S062800, C156S308200, C156S308400, C156S308600, C156S314000, C156S296000, C442S067000, C442S118000, C442S164000, C427S118000, C427S220000, C427S221000
Reexamination Certificate
active
07459044
ABSTRACT:
A sheet comprising thermoplastic polymer (TP) and short high tensile modulus fibers, in which the concentration of TP in the middle of the sheet is higher than at the surface of the sheet, useful for making prepregs with a thermoset resin.
REFERENCES:
patent: 3591434 (1971-07-01), Hartstein
patent: 3686048 (1972-08-01), Schirtzinger
patent: 3717528 (1973-02-01), Peerman et al.
patent: 4704172 (1987-11-01), Katz
patent: 4895752 (1990-01-01), McEwen
patent: 5196259 (1993-03-01), Pierini et al.
patent: 5306545 (1994-04-01), Shirayanagi et al.
patent: 5695373 (1997-12-01), Blackmore et al.
patent: 6037281 (2000-03-01), Mathis et al.
patent: 6255236 (2001-07-01), Cree et al.
patent: 6368698 (2002-04-01), Rokman et al.
patent: 6805771 (2004-10-01), Colson et al.
patent: 6974514 (2005-12-01), Hamulski et al.
patent: 2002/0153111 (2002-10-01), Kumada et al.
patent: WO 88/04185 (1988-06-01), None
Derwent Publication Ltd., JP 53-111369, Nitto Electric Ind., Co. Sep. 28, 1978, Abstract.
Derwent Publication Ltd., JP 08 252372, Toray Ind., Inc., Oct. 3, 1955, Abstract.
Khan Subhotosh
Levit Mikhail R.
Samuels Michael Robert
E. I. du Pont de Nemours and Company
Lam Cathy F.
LandOfFree
Sheet material especially useful for circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Sheet material especially useful for circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sheet material especially useful for circuit boards will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4032997