Sheet material and wiring board

Details Sheet material and wiring board Sheet material and wiring board

2007-11-13

2007-11-13

Lam, Cathy F. (Department: 1775)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Composite having voids in a component

C428S304400, C428S308400, C428S209000, C174S258000

Reexamination Certificate

active

11167623

ABSTRACT:
In a sheet material (1), a bonding layer (2) is provided, and then a high-strength layer (3) is laminated on the bonding layer (2). The bonding layer (2) is made of an epoxy resin being a thermosetting material. The high-strength layer (3) is made of polyimide, which is not softened at a thermosetting temperature of the epoxy resin and has a tensile rupture strength higher than that of the cured thermosetting material. Moreover, the polyimide has a tensile rupture strength of 100 MPa or higher at 23° C. and a tensile rupture elongation of 10% or higher at 23° C. Assuming that a tensile rupture strength at −65° C. is a and a tensile rupture strength at 150° C. is b, a ratio (a/b) is 2.5 or less.

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International Search Report for Corresponding International Application PCT/JP03/14732 dated Mar. 9, 2004.

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