Sheet cutting table

Details Sheet cutting table Sheet cutting table

2011-06-07

2011-06-07

Nguyen, Khanh (Department: 1746)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With cutting, punching, piercing, severing, or tearing

C156S506000, C156S353000, C156S497000, C156S250000, C083S471000, C083S471100, C083S471200, C083S471300, C083S472000, C083S473000, C083S474000, C083S475000, C083S476000, C083S477000, C083S477100, C083S477200, C248S683000, C248S684000

Reexamination Certificate

active

07954533

ABSTRACT:
A sheet cutting table13,after sticking an adhesive sheet S to a semiconductor wafer W, for cutting the area outside the semiconductor wafer W as an unnecessary adhesive sheet S1with a cutting device15.The table13includes an inner table52which supports the semiconductor wafer W, and an outer table51corresponding to the unnecessary adhesive sheet S1outside the semiconductor wafer W. The upper surface of the outer table51is provided with a non-adherable treatment surface51A, and an adherable member formed with a ring member53or a plate member63for sticking the adhesive sheet S thereto.

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PCT/JP2006/319931 International Search Report.

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