Metal working – Method of mechanical manufacture – Electrical device making
Patent
1991-02-28
1992-07-28
Echols, P. W.
Metal working
Method of mechanical manufacture
Electrical device making
29844, 439 66, H01R 900, H01R 914
Patent
active
051331195
ABSTRACT:
An apparatus and method for providing electrical contact between an array of fingers of a tape automated bonding frame and a corresponding array of raised contact areas on a substrate. The tape automated bonding frame is preferably a multi-metal member having at least one utility plane. A load plate having downwardly projecting regions is pressed onto the tape automated bonding frame on a side opposite to the substrate. The substrate may be a printed circuit board and the raised contact areas may be conductive pads. The ends of the fingers of the tape automated bonding frame are precisely aligned with the raised contact areas of the substrate. The downwardly projecting regions of the load plate are generally rigid and provide a compression force between adjacent contact areas and between adjacent finger ends. Displacement of the tape automated bonding frame provided by the downwardly projecting regions of the load plate cause the finger ends to conform to the upper surfaces of the contact areas, thereby insuring effective electrical contact between the finger ends and the contact areas.
REFERENCES:
patent: 3736549 (1973-05-01), Clements
patent: 4012093 (1977-03-01), Crane
patent: 4367004 (1983-01-01), Fujiura et al.
patent: 4865193 (1989-09-01), Shimamoto et al.
Afshari Bahram
Hanlon Lawrence
Matta Farid
Echols P. W.
Hewlett--Packard Company
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