Metal fusion bonding – With means to remove – compact – or shape applied flux or filler – By fluid blast or suction
Patent
1997-06-11
2000-10-17
Ryan, Patrick
Metal fusion bonding
With means to remove, compact, or shape applied flux or filler
By fluid blast or suction
228 205, 228191, 83869, B23K 522, B23K 1018, B26D 302
Patent
active
061317942
ABSTRACT:
A shaving or shearing blade utilized in dressing solder joint chip technologies without the use of heat or a copper block wicking process. In essence, any solder debris resulting from the solder shaving process as implemented by the shaving blade is removed through the intermediary of a vacuum arrangement located as an integral structure in the shaving blade so as to inhibit the potential formation of electrical shorts or causing solder damage in subsequent replacement chip joins or other assembly operations.
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Burke Jac Anders
Olson David Charles
Tersigni James Edward
Wolfe Jeffrey Scott
Ahasn, Esq. Aziz M.
International Business Machines Corp.
Ryan Patrick
Stoner Kiley
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