Shaving blade for chip site dressing

Metal fusion bonding – With means to remove – compact – or shape applied flux or filler – By fluid blast or suction

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Details

228 205, 228191, 83869, B23K 522, B23K 1018, B26D 302

Patent

active

061317942

ABSTRACT:
A shaving or shearing blade utilized in dressing solder joint chip technologies without the use of heat or a copper block wicking process. In essence, any solder debris resulting from the solder shaving process as implemented by the shaving blade is removed through the intermediary of a vacuum arrangement located as an integral structure in the shaving blade so as to inhibit the potential formation of electrical shorts or causing solder damage in subsequent replacement chip joins or other assembly operations.

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R.D. McNutt and K. Schink. "Chip Removal and Chip Site Dressing" IBM Tech. Dis. Bull. pp. 1288-1289, Jul. 1981.
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