Shared package for VRM and processor unit

Details Shared package for VRM and processor unit Shared package for VRM and processor unit

1999-12-29

2001-10-30

Wong, Peter S. (Department: 2838)

Electric power conversion systems

Current conversion

Integrated circuit

C361S728000, C361S820000

Reexamination Certificate

active

06310792

ABSTRACT:

FIELD
The present invention relates to the field of component packaging. In particular, the present invention relates to a common packaging for a processor and at least a portion of a voltage regulator module.
BACKGROUND
With today's processors requiring increased current and slew rates, in order to accommodate the requirement for increased internal frequencies, along with progressing voltage reductions, it is necessary to improve the performance of the voltage regulator modules associated with the respective processors.
Currently, however, steep current prorogation from a voltage regulator module to a processor is limited by the impedance of the connections between the voltage regulator module and the processor. In particular, of utmost concern as a limiting factor of the steep current propogation from the voltage regulator module and the processor is the inductance of the current distribution path therebetween. That is, inductance in the connections between the voltage regulator module and a processor can cut off the rate of change of current therebetween.
In order to reduce the inductance of the current distribution path between the voltage regulator module and the processor, the length of conductors therebetween must be minimized. That is, the actual physical distance between the voltage regulator module and the processor must be minimized, to thereby reduce the inductance in the connections therebetween and thus prevent the rate of change of current from being reduced.
FIG. 1
shows an implementation of a component package and voltage regulator module. The package
1
, which includes the processor therein, is mounted on substrate
8
which is secured to the motherboard
9
by sockets
6
, fan/heatsink
3
is placed on top of the package
1
, and fan
4
is provided above the package
1
. Further, the package is held in place by surface mount component
5
. Voltage regulator module
2
is not at all a part of package
1
, and therefore must be plugged into a receptacle
12
on the motherboard
9
.
SUMMARY
According to an embodiment of the present invention, a component module includes a processor and at least a portion of a voltage regulator module which regulates voltages being supplied to said processor.


REFERENCES:
patent: 5627413 (1997-05-01), Mughir et al.
patent: 5648759 (1997-07-01), Miller et al.
patent: 5834856 (1998-10-01), Tavallaci et al.
patent: 5918023 (1999-06-01), Reeves et al.
patent: 5923682 (1999-07-01), Sevyedy
patent: 5951665 (1999-09-01), Crane, Jr. et al.
patent: 5959848 (1999-09-01), Groves et al.
patent: 6028773 (2000-02-01), Hundt
patent: 6038633 (2000-03-01), Tavallaci
patent: 6051964 (2000-04-01), Brown et al.

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