Shared hole orthogonal footprint with backdrilled vias

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Reexamination Certificate

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Reexamination Certificate

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07540744

ABSTRACT:
In an electrical system, such as an orthogonal, midplane architecture, backdrilling vias may enable selective connectivity to components of the midplane board without custom connectors and/or contacts. A first contact and a second contact may be received within a shared backdrilled via at opposite ends. The backdrilled via may establish electrical connectivity between the first contact and an internal conductive path of a midplane board. Because the backdrilling removes a portion of the via, the first contact and the second contact may be electrically isolated. The electrically conductive path between the first mounting contact and the internal conductive layer may be used for low-speed communications channel, power, ground, control signaling, or the like.

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