Shared bond pad for testing a memory within a packaged...

Details Shared bond pad for testing a memory within a packaged... Shared bond pad for testing a memory within a packaged...

2007-07-17

2007-07-17

Tang, Minh N. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S763010, C324S1540PB, C365S201000

Reexamination Certificate

active

11223286

ABSTRACT:
A system is provided for communicating with a device within a packaged semiconductor device through a shared external terminal thereof. As one example, the system provides for testing a memory within the package. In addition to the device and the shared external terminal, the system includes a command register that receives a plurality of command signals, and digital logic devices coupled between the external terminal and the command register. Each of the digital logic devices receives a different clock signal and outputs one of the command signals to the command register. The command signals are provided to the external terminal in a sequence that is coordinated with the clock signals so that each digital logic device buffers one of the command signals.

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