Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent
1993-04-30
1995-12-19
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
257673, 257692, 257780, 257773, 428596, 439246, H01L 2348, H01L 2944, H01L 2952, H01L 2960
Patent
active
054770866
ABSTRACT:
Positive mechanical alignment is provided between substrates using micro-bump contacts by forming "detented" conductive bump contacts on one substrate having a concave end which receive and align the generally convex contour of bump contacts on the other substrate. Various configurations of concavities and convexities are described. Flux may be disposed in the concave end of the detented bump contact to promote formation of joints between the concave and convex bump contacts. Both bump contacts may be formed of reflowable material, such as solder, or one or the other of the contacts may be formed of a non-reflowable material which may also function as a standoff between the two substrates. Each substrate is provided with a plurality of bump contacts, and one substrate may be provided with a combination of convex and concave bump contacts corresponding to concave and convex bump contacts on the other substrate. The inventive technique is useful for joining die-to-die, die-to-substrate, or package-to-substrate.
REFERENCES:
patent: 3339274 (1967-09-01), Saia et al.
patent: 3461357 (1969-08-01), Mutter et al.
patent: 4151543 (1979-04-01), Hayakawa et al.
patent: 4857482 (1989-08-01), Saito et al.
patent: 5014111 (1991-05-01), Tsuda et al.
patent: 5196726 (1993-03-01), Nishigochi et al.
patent: 5311402 (1994-05-01), Kobayashi et al.
IBM TDB vol. 16, No. 11, Apr. 1974 Lead-Indium for Joining a Semiconductor Chip to a Substrate, Goldmann et al. pp. 3610-3611.
IBM TDB vol. 32 No. 10B Mar. 1990 p. 480 "Encapsulated Solder Joint for Chip Mounting".
Pasch Nicholas F.
Rostoker Michael D.
Arroyo T. M.
Hille Rolf
LSI Logic Corporation
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