Shaped cutting-grade inserts with transitionless...

Boring or penetrating the earth – Bit or bit element – Impact or percussion type

Reexamination Certificate

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C175S426000

Reexamination Certificate

active

06845828

ABSTRACT:
A thin layer of carbide containing an ultra-hard component, such as diamond, is applied to a formed compact for a drilling tool. The compact is then subjected to a high-temperature, high-pressure process to bond it to the added layer. This process allows the use of an underlying substrate which has a lower binder content than previously possible. The compact provides superior cutting ability, as even if the diamond-enhanced layer wears through, the carbide can provide enhanced hardness.

REFERENCES:
patent: 5335738 (1994-08-01), Waldenstrom et al.
patent: 5594931 (1997-01-01), Krall et al.
patent: 5871060 (1999-02-01), Jensen et al.
patent: 5944129 (1999-08-01), Jensen
patent: 0 399 679 (1990-11-01), None
patent: 2 307 933 (1997-06-01), None

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