Shaped bodies and production of semiconductor material

Details Shaped bodies and production of semiconductor material Shaped bodies and production of semiconductor material

1975-05-21

1977-07-12

Pavelko, Thomas P.

Plastic and nonmetallic article shaping or treating: processes

Gas or vapor deposition of article forming material onto...

264317, 264327, B01J 1730, B01J 1732

Patent

active

040354601

ABSTRACT:
A technique for producing one or more shaped bodies of semiconductor material using the steps of depositing a layer of the semiconductor material from the gas phase onto the outer surface of a heated, hollow carrier body, or onto the mutually remote surfaces of two carrier bodies spaced from one another, and thereafter removing the carrier body or bodies from the layer or layers so formed. Each carrier body is heated indirectly by a heater body located within said hollow carrier body, or between said spaced carrier bodies, and heated to a temperature above the deposition temperature of the semiconductor material.

REFERENCES:
patent: 3747559 (1973-07-01), Dietze
patent: 3751539 (1973-08-01), Reuschel

Affiliated with

Also associated with

Rating

Shaped bodies and production of semiconductor material does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Shaped bodies and production of semiconductor material, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Shaped bodies and production of semiconductor material will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-488215