Shaped bodies and production of semiconductor material

Details Shaped bodies and production of semiconductor material Shaped bodies and production of semiconductor material

1975-04-21

1977-07-12

McIntosh, John P.

Coating apparatus

With cutting, punching or tearing of work

Web or sheet work

C23C 1308

Patent

active

040347052

ABSTRACT:
A technique for producing one or more shaped bodies of semiconductor material using the steps of depositing a layer of the semiconductor material from the gas phase onto the outer surface of a heated, hollow carrier body, or onto the mutually remote surfaces of two carrier bodies spaced from one another, and thereafter removing the carrier body or bodies from the layer or layers so formed. Each carrier body is heated indirectly by a heater body located within said hollow carrier body, or between said spaced carrier bodies, and heated to a temperature above the deposition temperature of the semiconductor material.

REFERENCES:
patent: 3304908 (1967-02-01), Gutsche et al.
patent: 3306764 (1967-02-01), Lewis et al.
patent: 3442617 (1969-05-01), Turkat et al.
patent: 3460510 (1969-08-01), Currin
patent: 3502847 (1970-03-01), Heide
patent: 3746496 (1973-07-01), Dietze et al.
patent: 3747559 (1973-07-01), Dietze
patent: 3751539 (1973-08-01), Reuschel et al.

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