Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Reexamination Certificate
2008-12-12
2011-11-29
Rosasco, Stephen (Department: 1721)
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
C204S298140
Reexamination Certificate
active
08066857
ABSTRACT:
A physical vapor deposition apparatus includes a vacuum chamber with side walls, a cathode, a radio frequency power supply, a substrate support, a shield, and an anode. The cathode is inside the vacuum chamber, and the cathode includes a sputtering target. The radio frequency power supply is configured to apply power to the cathode. The substrate support is inside and electrically isolated from the side walls of the vacuum chamber. The shield is inside and electrically connected to the side walls of the vacuum chamber. The anode is inside and electrically connected to the side walls of the vacuum chamber. The anode includes an annular body and an annular flange projecting inwardly from the annular body, and the annular flange is positioned to define a volume below the target for the generation of plasma.
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International Search Report and Written Opinion from International Application No. PCT/US2009/067147 dated Jul. 9, 2010, 8 pgs.
Birkmeyer Jeffrey
Li Youming
Fish & Richardson P.C.
FUJIFILM Corporation
Rosasco Stephen
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