Shape Bonding method

Details Shape Bonding method Shape Bonding method

2008-10-10

2010-10-12

Osele, Mark A. (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S291000, C264S258000

Reexamination Certificate

active

07811406

ABSTRACT:
The present invention is directed to a method of bonding at least two surfaces together. The methods step of the present invention include applying a strip of adhesive to a first surface along a predefined outer boundary of a bond area and thereby defining a remaining open area there within. A second surface, or gusset plate, is affixed onto the adhesive before the adhesive cures. The strip of adhesive is allowed to cure and then a second amount of adhesive is applied to cover the remaining open area and substantially fill a void between said first and second surfaces about said bond area. A stencil may be used to precisely apply the strip of adhesive. When the strip cures, it acts as a dam to prevent overflow of the subsequent application of adhesive to undesired areas. The method results in a precise bond area free of undesired shapes and of a preferred profile which eliminate the drawbacks of the prior art bonds.

REFERENCES:
patent: 4640583 (1987-02-01), Hoshikawa et al.
patent: 6432253 (2002-08-01), Chung
patent: 2002/0197843 (2002-12-01), Jiang et al.

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