Shampoo compositions and suspending agent therefor

Details Shampoo compositions and suspending agent therefor Shampoo compositions and suspending agent therefor

1994-09-06

1996-12-24

Dodson, Shelley A.

Drug, bio-affecting and body treating compositions

Live hair or scalp treating compositions

Polymer containing

424 7012, 424 70122, 424 7014, 424 7015, 424 7024, 424 7031, 514880, 514881, 510123, 510124, A61K 706, C11D 348, C11D 950

Patent

active

055871542

ABSTRACT:
A hair shampoo composition comprising a cleansing surfactant; a water-insoluble hair treating compound, like a hair conditioner or an antidandruff agent; a suspending agent comprising an amine including at least one long carbon chain and a suitable acid; and a suitable carrier, and a method of treating hair are disclosed. The shampoo compositions effectively suspend the water-insoluble hair-treating compound, effectively cleanse the hair and effectively deliver the water-insoluble hair-treating compound to the hair or scalp.

REFERENCES:
patent: 4281201 (1981-07-01), Abend
patent: 4472375 (1984-09-01), Bolich, Jr. et al.
patent: 4548810 (1985-10-01), Zofchak
patent: 4704272 (1987-11-01), Oh et al.
patent: 4741855 (1988-05-01), Grote et al.
patent: 4788006 (1988-11-01), Bolich, Jr. et al.
patent: 4796646 (1989-01-01), Grollier et al.
patent: 4876085 (1989-10-01), Grollier et al.
patent: 4902499 (1990-02-01), Bolich, Jr. et al.
patent: 4960588 (1990-10-01), Hoshowski et al.
patent: 5059414 (1991-10-01), Dallal et al.
patent: 5156837 (1992-10-01), Chaudhuri et al.
patent: 5393519 (1995-02-01), Dowell et al.

Affiliated with

Also associated with

Rating

Shampoo compositions and suspending agent therefor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Shampoo compositions and suspending agent therefor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Shampoo compositions and suspending agent therefor will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1177074