Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
Reexamination Certificate
2007-07-10
2007-07-10
Tsai, H. Jey (Department: 2812)
Semiconductor device manufacturing: process
Formation of electrically isolated lateral semiconductive...
Grooved and refilled with deposited dielectric material
C438S426000, C438S427000
Reexamination Certificate
active
11485838
ABSTRACT:
A method for forming an isolation structure on a semiconductor substrate includes opening a portion of a pad oxide layer overlying the substrate using a process gas including an etchant gas and a polymer-forming gas. A portion of the substrate exposed by the opening step is etched to form a trench having a first slope and a second slope. The first slope is greater than 45 degrees, and the second slope is less than 45 degrees. The trench is filled to form the isolation structure.
REFERENCES:
patent: 7091104 (2006-08-01), Kim et al.
Chien Choong Shiau
Ghee Ch'ng Toh
Inoue Naoto
Kim Inki
Kim Sang Yeon
SilTerra Malaysia Sdn. Bhd.
Townsend and Townsend / and Crew LLP
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