Measuring and testing – Coating material: ink adhesive and/or plastic
Patent
1982-12-20
1985-04-16
Turk, Arnold
Measuring and testing
Coating material: ink adhesive and/or plastic
73104, 436 2, 436164, G01B 1102
Patent
active
045107980
ABSTRACT:
A technique for accurately and repeatably measuring the depths of junctions between adjacent layers in a semiconductor wafer, even when the depths are relatively shallow. A groove is formed in the surface of the wafer, with a cylindrical grooving tool that is inclined to the planar surface of the wafer, to form a groove that is tapered in width and depth. The wafer is then conventionally treated to enhance the contrast between the layers as they are exposed on the groove surface. Since each planar junction intersects the groove surface at an angle, the corresponding junction line appears as a part of an ellipse, and exhibits a well defined peak at the center of the groove. Direct measurement of the depth of the groove at this point, using a standard profilometer, provides the desired junction depth.
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patent: 4103542 (1978-08-01), Wheeler et al.
patent: 4235018 (1980-11-01), Saberg
patent: 4391044 (1973-07-01), Wheeler
Hardwick, Rev. Sci. Instrum., vol. 42, No.4, (Apr. 1971), pp. 541-543.
Yeh, IBM Technical Disclosure Bulletin, vol. 5, No. 5, Oct. 1962, "Portraying PN Junctions in Gallium Arsenide".
Hikin Boris L.
Prussin Simon A.
Heal Noel F.
Nyhagen Donald R.
TRW Inc.
Turk Arnold
Wallace Robert M.
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