Shadow mask and manufacturing method thereof

Radiation imagery chemistry: process – composition – or product th – Producing cathode-ray tube or element thereof

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C430S320000, C430S005000, C313S402000

Reexamination Certificate

active

08007967

ABSTRACT:
Disclosed is a shadow mask having a fine slit that can improve precision and resolution of a pattern by reducing side etching during an etching process of a mask substrate, and a manufacturing method thereof. The shadow mask includes a mask substrate, a slit region formed by penetrating through the mask substrate, the slit region having a plurality of undercut portions at respective sides thereof, each undercut portion having a unit thickness, and a shadow region provided in the mask substrate, the shadow region corresponding to a region other than the slit region.

REFERENCES:
patent: 5164021 (1992-11-01), Kato et al.
patent: 2004/0067346 (2004-04-01), Hofmann et al.
patent: 62042523 (1987-02-01), None
patent: 09 157799 (1997-06-01), None
patent: 2002-212763 (2002-07-01), None
patent: 2003-229073 (2003-08-01), None
Translation JP-2003-229073(Aug. 2003).
Translation JP-2002-212763(Jul. 2002).
Translation JP-09157799.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Shadow mask and manufacturing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Shadow mask and manufacturing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Shadow mask and manufacturing method thereof will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2688592

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.