Severing wire or ribbon material adjacent an attachment point, s

Details Severing wire or ribbon material adjacent an attachment point, s Severing wire or ribbon material adjacent an attachment point, s

1977-03-11

1978-07-11

Kelly, Donald G.

Metal fusion bonding

Process

With shaping

29628, 228 45, 228 13, 228904, B23K 3102

Patent

active

040996638

ABSTRACT:
The wire, ribbon, or the like, is repetitively bent back and forth until it breaks, the bending being, preferably, effected rapidly, for example by means of an electromagnet fed, for example, with line frequency alternating current. The wire is guided in a guide tool which deflects the wire transversely to its axis rapidly back and forth, thus effecting breaking within about one second of application of bending stresses. This is particularly useful to sever tiny wires, in the order of 100 .mu.m diameter, as connecting leads in semiconductor and thin film technology.

REFERENCES:
patent: 3747198 (1973-07-01), Benson
patent: 3999451 (1976-12-01), Ogle

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