Severable conductive path in an integrated-circuit device

Details Severable conductive path in an integrated-circuit device Severable conductive path in an integrated-circuit device

1990-08-20

1991-11-19

Carroll, J.

357 65, H01L 2702, H01L 2348

Patent

active

050669982

ABSTRACT:
Integrated-circuit devices are provided with conductive paths or links which, by laser irradiation or electric current pulsing, can be severed or fused. In the interest of ease of fusing, preferred links have locally reduced thickness as achieved, e.g., by employing two steps of layer deposition and etching as follows: first, a layer of conductor material is deposited on a dielectric surface, and locally reduced in thickness by etching at one or several points selected for fusing, and, second, a further layer of conductor material is deposited, and then etched to produce a desired conductive path passing through such points.

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