Set up for a first integrated circuit chip to allow for...

Data processing: measuring – calibrating – or testing – Testing system – Of circuit

Reexamination Certificate

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C702S120000

Reexamination Certificate

active

07006940

ABSTRACT:
A method and system are provided for testing a first integrated circuit chip which is packaged along with at least a second integrated circuit chip in a semiconductor device, wherein at least some external terminals for the semiconductor device are shared by the first and second integrated circuit chips. The method and system include: powering down the second integrated circuit chip; tri-stating a plurality of input/output (I/O) drivers of the second integrated circuit chip so that the plurality of I/O drivers do not drive any signals onto any connections for the shared external terminals; and performing testing of the first integrated circuit chip according to one or more regular testing routines.

REFERENCES:
patent: 6351681 (2002-02-01), Chih et al.
patent: 6675269 (2004-01-01), Miura et al.
patent: 6711042 (2004-03-01), Ishikawa
patent: 2002/0017720 (2002-02-01), Nishizawa et al.
patent: 2003/0235929 (2003-12-01), Cowles et al.
patent: 2004/0027150 (2004-02-01), Miura et al.
patent: 2004/0100296 (2004-05-01), Ong
patent: 2004/0150089 (2004-08-01), Inoue et al.
patent: 2004/0196709 (2004-10-01), Ong

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