Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2010-05-04
2011-10-25
Datskovskiy, Michail V (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S690000, C361S679480, C361S679500, C361S679510, C361S727000, C165S080300, C165S121000, C165S122000, C165S185000, C454S184000, C415S213100, C415S214100
Reexamination Certificate
active
08045328
ABSTRACT:
A server and cooler module arrangement includes a server accommodating a stack of an operating system and an electronic device in an accommodation chamber therein at one side and an access device unit in the accommodation chamber at an opposite side, and a cooler module, which comprises a rack mounted in a partition way in the accommodation chamber between the stack of operating system and electronic device and the access device unit and a plurality of fans respectively adjustably mounted in respective open frames at different elevations and adapted for drawing air or sending air toward different heat sources in the operating system, the electronic device and the access device unit for quick dissipation of waste heat.
REFERENCES:
patent: 4918572 (1990-04-01), Tarver et al.
patent: 5398161 (1995-03-01), Roy
patent: 5816673 (1998-10-01), Sauer et al.
patent: 6002586 (1999-12-01), Chen et al.
patent: 6088224 (2000-07-01), Gallagher et al.
patent: 6115250 (2000-09-01), Schmitt
patent: 6288897 (2001-09-01), Fritschle et al.
patent: 6392872 (2002-05-01), Doustou et al.
patent: 6504718 (2003-01-01), Wu
patent: 6795314 (2004-09-01), Arbogast et al.
patent: 6839233 (2005-01-01), Cravens et al.
patent: 7033206 (2006-04-01), Chang et al.
patent: 7046470 (2006-05-01), Yamanashi et al.
patent: 7209352 (2007-04-01), Chen
patent: 7352571 (2008-04-01), Suzuki et al.
patent: 7369406 (2008-05-01), Matsushima et al.
patent: 7374259 (2008-05-01), Wu et al.
patent: 7394660 (2008-07-01), Hidaka
patent: 7643281 (2010-01-01), Okamoto et al.
patent: 7839624 (2010-11-01), Lin
patent: 7864523 (2011-01-01), Iwakiri
patent: 7920384 (2011-04-01), Westphall et al.
patent: 2005/0227608 (2005-10-01), Wu et al.
patent: 2005/0243513 (2005-11-01), Chou et al.
patent: 2006/0126302 (2006-06-01), Lee et al.
patent: 2007/0135033 (2007-06-01), Kao et al.
patent: 2009/0009961 (2009-01-01), Li
patent: 2009/0244842 (2009-10-01), Iwakiri
patent: 2011/0021132 (2011-01-01), Chou et al.
patent: 2011/0090629 (2011-04-01), Liu
patent: 2011/0116226 (2011-05-01), Yang
Chenbro Micom Co., Ltd.
Datskovskiy Michail V
Muncy Geissler Olds & Lowe, PLLC
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