Sequential ion implantation and deposition (SIID) technique

Details Sequential ion implantation and deposition (SIID) technique Sequential ion implantation and deposition (SIID) technique

1996-08-30

2000-07-04

King, Roy V.

Coating processes

Direct application of electrical, magnetic, wave, or...

Ion plating or implantation

427527, 427528, 427529, 427530, 427531, 148239, C23C 1448, B05D 306

Patent

active

060835672

ABSTRACT:
A surface of a substrate is vacuum coated with a material by sequentially implanting and depositing ions from a single ion source. First ions of the coating material are initially implanted into the surface of the substrate to form an implanted substrate layer. Next, second ions of the material are deposited on the implanted substrate layer to form a seed layer. Third ions of the material are then implanted into the seed layer to form an intermixed layer. Fourth ions of the material are deposited over the intermixed layer to form the coating over the substrate.

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patent: 4915746 (1990-04-01), Welsch
patent: 5520966 (1996-05-01), Kornely, Jr.
patent: 5543183 (1996-08-01), Streckert et al.

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