Sequential electrodeposition of metals using modulated...

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly single metal or alloy coating on...

Reexamination Certificate

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C205S123000, C205S125000, C205S920000

Reexamination Certificate

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06863793

ABSTRACT:
A continuous layer of a metal is electrodeposited onto a substrate having both hydrodynamically inaccessible recesses and hydrodynamically accessible recesses on its surface by a twostep process in which the hydrodynamically inaccessible recesses are plated using a pulsed reversing current with cathodic pulses having a duty cycle of less than about 50% and anodic pulses having a duty cycle of greater than about 50% and the hydrodynamically accessible recesses are then plated using a pulsed reversing current with cathodic pulses having a duty cycle of greater than about 50% and anodic pulses having a duty cycle of less than about 50%.

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West, Alan C. et al., “Pulse Reverse Copper Electrodeposition of High Aspect Ratio Trenches and Vias,” J. Electrochem. Soc., vol. 45, No. 9, pp. 3070-3074, Sep. 1998.

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