Separation of wafer into die with wafer-level processing

Details Separation of wafer into die with wafer-level processing Separation of wafer into die with wafer-level processing

1995-01-06

1997-01-28

Picardat, Kevin M.

Fishing, trapping, and vermin destroying

437226, 437229, 148DIG12, 148DIG28, H01L 21302

Patent

active

055977677

ABSTRACT:
A method of separating wafers, such as those used for semiconductor device manufacture, into die. A partly fabricated wafer is covered with a protective coating over its top surface (10). The wafer is then inscribed to define separation lines between die, with the separation lines being of a predetermined depth (12). The protective coating is then removed (14), and at least one processing step is performed at the wafer level (15, 22-24), before the inscribed wafer is separated into die. Then, the wafer is separated into die along the separation lines (17).

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