Separation of diode array chips during fabrication thereof

Details Separation of diode array chips during fabrication thereof Separation of diode array chips during fabrication thereof

1991-03-01

1994-04-05

Ngo, Ngan

Active solid-state devices (e.g., transistors, solid-state diode

With groove to define plural diodes

257 79, 257 88, 257622, 257797, H01L 3300, H01L 2906, H01L 2710

Patent

active

053008065

ABSTRACT:
Rather than being separated along a single cleavage line between their adjacent ends, diode arrays are spaced apart on a fabrication wafer to allow parallel cleavage lines to be established between the ends of each adjacent pair of arrays by scribed grooves located along opposite sides of a narrow disposable strip of wafer material. A cleaving technique substantially insures that any projecting lip along the cleavage plane will be on the disposable strip rather than on a diode chip, so that such a defect cannot interfere with proper end-to-end spacing of the chips when they are subsequently assembled to provide a continuous row of chips with uniformly spaced individual light-emitting sites.

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