Separating wafers coated with plastic films

Details Separating wafers coated with plastic films Separating wafers coated with plastic films

2006-07-04

2006-07-04

Weiss, Howard (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S761000

Reexamination Certificate

active

07071025

ABSTRACT:
The method of protecting micromechanical structures during a wafer fabrication process. A protective layer402is deposited to protect the fragile microstructures during a wafer separation process and a post separation cleanup process. Suitable protective layers402typically are plastic and tend to deform or delaminate when the wafer is sawn. The deformation of the protective overcoat during the saw process destroys the structures it is intended to protect. To prevent deformation of the protective layer402,a brittle layer404is deposited on the protective layer402to hold the protective layer in place during the saw process. Cured photoresist is a suitable protective layer. The photoresist can be applied to the protective layer using standard processes and cured, typically by baking the photoresist. Once the wafer is separated, the brittle layer may be removed. After the debris created during the saw process is removed, the protective overcoat may be removed. The brittle layer404and the protective overcoat402may be removed at the same time. The preceding abstract is submitted with the understanding that it only will be used to assist in determining, from a cursory inspection, the nature and gist of the technical disclosure as described in 37 C.F.R. § 1.72(b). In no case should this abstract be used for interpreting the scope of any patent claims.

REFERENCES:
patent: 5061049 (1991-10-01), Hornbeck
patent: 5583688 (1996-12-01), Hornbeck
patent: 6335224 (2002-01-01), Peterson et al.
patent: 6401545 (2002-06-01), Monk et al.
patent: 2002/0012744 (2002-01-01), Miller et al.
patent: 2002/0135864 (2002-09-01), Chiu et al.
U.S. Appl. No. 10/036,698, filed Dec. 31, 2001, Jacobs.
U.S. Appl. No. 10/038,791, filed Dec. 31, 2001, Kaeriyama.

Affiliated with

Also associated with

Rating

Separating wafers coated with plastic films does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Separating wafers coated with plastic films, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Separating wafers coated with plastic films will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3575109