Article dispensing – With orienting – Selective separation from supply
Reexamination Certificate
1999-01-22
2001-04-24
Noland, Kenneth W. (Department: 3651)
Article dispensing
With orienting
Selective separation from supply
C221S277000
Reexamination Certificate
active
06220481
ABSTRACT:
This application corresponds to Japanese Patent Application No. 10-29158, filed Jan. 27, 1998 which is incorporated in its entirety by reference herein.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates generally to a chip feeding system and, more particularly, to a system and method for separating chip components, such as electronic chip components, to thereby allow for individual feeding of the components.
2. Description of the Related Art
A separating feeder having substantially increased capacity for feeding chip components over that of an oscillating ball feeder or a linear feeder has been disclosed in, for example, Japanese Examined Utility Model Publication No. 62-28592. In this separating feeder, a rotating inner disk and an outer disk, which intermittently rotates along the outer periphery of the inner disk, are disposed at a slant to a horizontal plane. The outer disk has an annular trough comprised of a plurality of fitting holes for aligning chip components. The annular trough is disposed at the same level as the end of the inner disk.
The inner disk and the outer disk are rotated in opposite directions to each other. As a result of the rotation of the inner and outer disks, the chip components are individually separated by dropping through the fitting holes. While this process efficiently separates circular disk-shaped chip components, rectangular-shaped chip components fall less effectively through the fitting holes, which decreases feeding efficiency. When small size chip components (e.g., chip components having a size of approximately 1 mm) are provided, orientation of the chip components dropped into the fitting holes may be unstable, since the fitting hole size should also be small in size. This results in a reduction of reliability.
SUMMARY OF THE INVENTION
Accordingly, it is an object of the present invention to provide a system and method for individually and efficiently separating chip components irrespective of chip component size and shape.
In order to achieve the above-mentioned object, an exemplary embodiment of the present invention provides a separating feeder for chip components which comprises: a scattering disk disposed such that the top surface thereof is inclined with respect to a horizontal plane; driving means for rotational driving the scattering disk; a transferring groove formed on the scattering disk extending outward, which aligns the chip components; and a cavity formed at an outer peripheral end portion of the transferring groove in which one chip component is held, wherein chip components are individually fed by holding the one chip component in the cavity.
A number of chip components are dumped on the scattering disk and accumulate in the bottom portion thereof since the top surface of the scattering disk is inclined. When the scattering disk is rotated, some of the chip components drop into the transferring grooves and are simultaneously aligned in a predetermined direction. Since the transferring grooves are formed so as to extend outward on the scattering disk, the probability of chip components dropping into the transferring grooves is greater than into the fitting holes of the conventional system. The chip components dropped into the transferring grooves slide toward the outer end peripheral portion of the transferring grooves toward the cavities as a result of the rotation of the scattering disk. Each cavity is formed of such a shape so as to allow it to receive and hold a single chip component. Thereafter the scattering disk is rotated so as to allow the chip components in the transferring grooves to slide downward toward the center of the disk, leaving only the chip component which has been received by the cavity. Chip components are then individually separated from the cavity at a predetermined location.
The shape of the transferring groove is not limited to radial shapes, but can be spiral, helical, etc. It is preferable that a number of grooves be formed on the scattering disk which extend in an outward direction. When rectangular-shaped chip components are fed, the width of the transferring groove is longer than the narrower edge of the chip component and smaller than the longer edge of the chip component to be able to longitudinally align the chip components.
According to exemplary embodiments of the present invention, the cavity may be formed in a stepped hole-shape at the outer peripheral end portion of the transferring groove or in a concave-shape in the circumferential direction (i.e., the trailing side of the rotation) at the outer peripheral end portion of the transferring groove. Other cavity shapes are also possible so long as the cavity is capable of receiving and holding a single chip component in such a manner so as to prevent the component from sliding downward toward the center of the disk.
The separating feeder of the present invention further comprises a rotatable outer-guide, disposed in the peripheral portion of the scattering disk, for preventing chip components on the scattering disk from dropping outside (e.g., from being ejected). It is preferable that the outer-guide be placed at least at the bottom (e.g., lower) portion of the scattering disk (and extend an arc of, e.g., over 180°). The rotatable outer-guide is unnecessary during those situations when a peripheral wall is disposed in the outer peripheral end portion of the scattering disk.
The separating feeder of the present invention further comprises an air-blowing nozzle disposed at the outer-guide for forcing chip components in the transferring groove, except for the chip component in the cavity, towards the center of the scattering disk. The air-blowing nozzle may be useful in those situations where chip components do not slide toward the scattering disk center (e.g., due to the angle of inclination of the scattering disk). The blown air provides the necessary momentum in such a situation to force the chip components to slide downward. As a result, smooth separation of the chip components is provided.
The separating feeder of the present invention may further comprise a guide ring disposed on the top surface of the scattering disk which forms a gate entrance for allowing only the chip components aligned in the transferring groove to move in the outward peripheral direction of the scattering disk. There is a concern that the chip components dumped on the scattering disk may be damaged by sliding along the outer guide, etc. The guide ring eliminates the sliding motion of chip components, thereby preventing damage to the chip components. By placing the gate entrance at the end of the transferring groove to prevent a plurality of chip components from being accumulated adjacent to the cavity, dispensing of the chip components can be improved.
The separating feeder of the present invention may further comprise an inner-ring disposed on the top surface of the scattering disk, forming an annular space for accommodating a number of chip components between the inner-ring and the guide ring. When the chip components dumped on the scattering disk are rotated in an upward direction, the chip components drop toward the center of the scattering disk. By restraining the fall of the chip components through the use of the inner ring, the chip components in the transferring groove can be rotated while retaining them in the groove.
The separating feeder of the present invention may further comprise an airblowing nozzle disposed at the inner-ring for urging chip components in the transferring groove in the direction of the outer diameter. When chip components cannot smoothly slide toward the outer peripheral end portion of the transferring groove due to friction between the transferring groove and the chip components, the chip components can be smoothly sent by a blast of blowing air.
The separating feeder of the present invention may further comprise an airsuction port disposed at the cavity of the scattering disk for holding a chip component within the cavity. In this case, the chip components in the cavity can be prevented fr
Burns Doane , Swecker, Mathis LLP
Murata Manufacturing Co. Ltd.
Noland Kenneth W.
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