Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
Reexamination Certificate
2005-03-15
2005-03-15
Smith, Matthew (Department: 2825)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Thinning of semiconductor substrate
C438S458000, C438S455000
Reexamination Certificate
active
06867110
ABSTRACT:
This invention is to guarantee that in separating a plate member such as a bonded substrate stack, a fluid is injected to an appropriate portion of the plate member. While a bonded substrate stack (50) is rotated, the vertical position of its peripheral portion is measured throughout its perimeter by a measuring device (150). Then, while the vertical position of a nozzle (120) is dynamically adjusted on the basis of the measurement result, and at the same time, the bonded substrate stack (50) is rotated, the bonded substrate stack (50) is separated into two substrates at a porous layer by injecting a fluid ejected from the nozzle (120).
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Fujimoto Akira
Kohda Mitsuharu
Sakaguchi Kiyofumi
Yanagita Kazutaka
Canon Kabushiki Kaisha
Fitzpatrick ,Cella, Harper & Scinto
Smith Matthew
Yevsikov Victor
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