Sensor surface with 3D curvature formed by electronics on a...

Details Sensor surface with 3D curvature formed by electronics on a... Sensor surface with 3D curvature formed by electronics on a...

2006-12-22

2010-06-08

Ometz, David L (Department: 2622)

Television

Camera, system and detail

Solid-state image sensor

C348S374000, C348S264000

Reexamination Certificate

active

07733397

ABSTRACT:
A method of making a curved sensor is described. The method involves projecting portions of a curved three dimensional structure such as a hemisphere onto a two dimensional substrate in an outline pattern. The outline pattern typically serves as a perimeter of a sensor. After forming a sensor in the shape of the outline pattern, the two dimensional substrate is flexed to form a three dimensional sensor structure.

REFERENCES:
patent: 4467361 (1984-08-01), Ohno et al.
patent: 5004328 (1991-04-01), Suzuki et al.
patent: 6233100 (2001-05-01), Chen et al.
patent: 6526160 (2003-02-01), Ito
patent: 2007/0296842 (2007-12-01), Connell
patent: 2009/0167884 (2009-07-01), Connell Jr.

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